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JAN06 (1/5) MITSUBISHI (OPTICAL DEVICES)
FU-68SDF-X3MYF
1.5 m DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL DESCRIPTION Module type FU-68SDF-X3MYF is a 1.5m band DFB-LD module with single-mode optical fiber. This module is suitable to a directly modulated light source for use in high power optical repieter for mobile communication system.
FEATURES * High liniality multi quantum wells (MQW) DFB-LD * Emission wavelength is in 1.5m band * Built-in optical isolator * Thermo electric cooler for laser temperature control * With photodiode for optical output monitor * RoHS (2002/95/EC) compliant
APPLICATION Repeater systems Radio on fiber Analog transmission systems
ABSOLUTE MAXIMUM RATINGS (Tld=25C) Parameter Symbol Conditions Rating Unit Laser diode Optical output Pf CW 15 mW power Forward current If CW 150 mA Reverse voltage Vrl 2 V Photodiode Reverse voltage Vrd 20 V Forward current Ifd 2 mA ThermoCooler current Ipe 1.3 A electric cooler Cooler voltage Vpe 3.1 V (Note) Operating case temperature Tc -20 ~ 70 C Storage temperature Tstg -40 ~ 85 C Note) Even if the thermo-electric cooler (TEC) is operated within the rated conditions, uncontrolled current loading or operation without heatsink may easily damage the module by exceeding the storage temperature range. Thermistor resistance should be properly monitored by the feedback circuit during TEC operation to avoid the catastrophic damage.
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein without notice. No liability is assumed as a result of their use or application. MITSUBISHI CONFIDENTIAL
JAN06 (2/5) MITSUBISHI (OPTICAL DEVICES)
FU-68SDF-X3MYF
1.5 m DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL ELECTRICAL/OPTICAL CHARACTERISTICS Parameter Symbol Threshold current Operating current Operating voltage Input impedance Light-emission central wavelength Ith Iop Vop Zin c ( Tc=Tld=25C unless otherwise noted ) Test Conditions Limits Min. Typ. CW 10 CW, Pf=10mW 60 CW, Pf=10mW 1.3 Pf=10mW 25 CW, Pf=10mW -x3M1F 1467 1470 -x3M2F 1487 1490 -x3M3F 1507 1510 -x3M4F 1527 1530 -x3M5F 1547 1550 -x3M6F 1567 1570 CW, Pf=10mW 33 40 -65 2 tone test f1=1997MHz, f2=2003MHz m=20%/tone, If(average)=Iop (Note 1) (Note 2) Pf=10mW 3.5 CW, Pf=10mW, 0.5~3GHz Tc=-20~70C, APC, ATC CW, Pf=10mW CW, Pf=10mW, Vrd=5V Tc=25C Tc=-20~70C Vrd=5V, Tc=-20~70C Vrd=5V, f=1MHz 0.12 0.2 35 23 -155 0.2 Unit Max. 25 100 1.8 1473 1493 1513 1533 1553 1573 -56 mA mA V nm
Side mode suppression ratio 3rd order distortion
Sr D3
dB dBc
Cutoff frequency (-1.5dB optical) Relative intensity noise Tracking error (Note 3) Differential efficiency Monitor current Optical isolation
fc Nr Er Imon Iso
-145 0.5 0.35 3 0.1 10
GHz dB/Hz dB mW/m A mA dB
Dark current (PD) Id A Capacitance (PD) Ct pF Note 1) If: LD forward current Note 2) Optical return loss of the connectors should be greater than 40dB in order to ensure the specified performance. Note 3) Er=max|10xlog(Pf / Pf@25C)|
THERMAL CHARACTERISTICS (Tld=25C, Tc=-20~70C) Parameter Symbol Test Conditions Thermistor resistance B constant of Rth Cooling capacity Cooler current Cooler voltage Rth B T Ipe Vpe Pf=10mW, Tc=70C Pf=10mW, Tc=70C Pf=10mW, Tc=70C Min. 9.5 45 -
Limits Typ. 10 3950 0.6 1.2
Unit Max. 10.5 1 2 k K C A V
FIBER PIGTAIL SPECIFICATIONS Parameter Type Mode field diameter Cladding diameter Secondary coating outer diameter Connector Optical return loss of connector
Limits SM 9.5+/-1 125+/-2 0.9+/-0.1 See Ordering information
Unit m m mm -
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein without notice. No liability is assumed as a result of their use or application. MITSUBISHI CONFIDENTIAL
JAN06 (3/5) MITSUBISHI (OPTICAL DEVICES)
FU-68SDF-X3MYF
1.5 m DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL DOCUMENTATION (Tld=25C) * Fiber output power vs. Laser forward current Tc=25C * Threshold current (Ith) * Laser forward current (Iop) at Pf=10mW * Laser forward voltage (Vop) at Pf=10mW * Monitor current (Imon) at Pf=10mW * Thermistor resistance (Rth) * Cooler current (Ipe) at Pf=10mW and Tc=70C * Cooler voltage (Vpe) at Pf=10mW and Tc=70C
ORDERING INFORMATION
FU - 68SDF - _ 3M _F
Wavelength (typ) 1470nm 1490nm 1510nm 1530nm 1550nm 1570nm
1 2 3 4 5 6
V W L
Connector FC/PC SC/PC SC/APC
Return loss 40dB min 40dB min 60dB min
Standard Optional Optional
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein without notice. No liability is assumed as a result of their use or application. MITSUBISHI CONFIDENTIAL
JAN06 (4/5) MITSUBISHI (OPTICAL DEVICES)
FU-68SDF-X3MYF
1.5 m DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL OUTLINE DIAGRAM Unless otherwise noted +/-0.5mm (Unit : mm)
FU-68SDF-X3MYF
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein without notice. No liability is assumed as a result of their use or application. MITSUBISHI CONFIDENTIAL
JAN06 (5/5) MITSUBISHI (OPTICAL DEVICES)
FU-68SDF-X3MYF
1.5 m DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL Safety Cautions for Use of Optoelectronic Devices General:
Although the manufacturer is always striving to improve the reliability of its product, problems and errors may occur with semiconductor products. Therefore, the user's products are required to be designed with full safety regard to prevent any accidents that results in injury, death, fire or environmental damage even when semiconductor products happen to error. Especially it is recommended to take in consideration about redundancy, fire prevention, error prevention safeguards. And the following requirements must be strictly observed.
Warning! 1. Eye safety : Seminductor laser radiates laser light during operation. Laser light is very dangerous when shot directly into human
eyes. Don't look at laser light directly, or through optics such as a lens. The laser light should be observed using the ITV camera, IRviewer, or other appropriate instruments. 2. Product handling : The product contains GaAs (gallium arsenide). It is safe for regular use, but harmful to the human body if made into powder or steam. Be sure to avoid dangerous process like smashing, burning, chemical etching. Never put this product in one's mouth or swallow it. 3. Product disposal : This product must be disposed of as special industrial waste. It is necessary to separate it from general industrial waste and general garbage.
Handling Cautions for Optoelectronic Devices 1. General:
(1) The products described in this specification are designed and manufactured for use in general communication systems or electronic devices, unless their applications or reliability are otherwise specified. Therefore, they are not designed or manufactured for installation in devices or systems that may affect human life or that are used in social infrastructure requiring high reliability. (2) When the customer is considering to use the products in special applications, such as transportation systems (automobiles, trains, vessels), medical equipments, aerospace, nuclear power control, and submarine repeaters or systems, please contact Mitsubishi Electric or an authorized distributor.
2. Shipping Conditions:
(1) During shipment, place the packing boxes in the correct direction, and fix them firmly to keep them immovable. Placing the boxes upside down, tilting, or applying abnormal pressure onto them may cause deformation in the electrode terminals, breaking of optical fiber, or other problems. (2) Never throw or drop the packing boxes. Hard impact on the boxes may cause break of the devices. (3) Take strict precautions to keep the devices dry when shipping under rain or snow.
3. Storage Conditions:
When storing the products, it is recommended to store them following the conditions described below without opening the packing. Not taking enough care in storing may result in defects in electrical characteristics, soldering quality, visual appearance, and so on. The main points are described below (if special storage conditions are given to the product in the specification sheet, they have priority over the following general cautions): (1) Appropriate temperature and humidity conditions, i.e., temperature range between 5~30C, and humidity between 40~60 percent RH, should be maintained in storage locations. Controlling the temperature and humidity within this range is particularly important in case of long-term storage for six months or more. (2) The atmosphere should be particularly free from toxic gases and dust. (3) Do not apply any load on the product. (4) Do not cut or bend the leads of the devices which are to be stored. This is to prevent corrosion in the cut or bent part of the lead causing soldering problems in the customer's assembling process. (5) Sudden change in temperature may cause condensation in the product or packing, therefore, such locations should be avoided for storing. Temperature in storage locations should be stable. (6) When storing ceramic package products for extended periods of time, the leads may turn reddish due to reaction with sulfur in the atmosphere. (7) Storage conditions for bare chip and unsealed products shall be stated separately because bare chip and unsealed products require stricter controls than package sealed products.
4. Design Conditions and Environment under Use:
(1) Avoid use in locations where water or organic solvents adhere directly to the product, or where there is any possibility of the generation of corrosive gas, explosive gas, dust, salinity, or other troublesome conditions. Such environments will not only significantly lower the reliability, but also may lead to serious accidents. (2) Operation in excess of the absolute maximum ratings can cause permanent damage to the device. The customers are requested to design not to exceed those ratings even for a short time.
5. ESD Safety Cautions:
The optoelectronic devices are sensitive to static electricity (ESD, electro-static discharge). The product can be broken by ESD. When handling this product, please observe the following countermeasures: To prevent break of devices by static electricity or surge, please adopt the following countermeasures in the assembly line: (1) Ground all equipments, machinery jigs, and tools in the process line with earth wires installed in them. Take particular care with hot plates, solder irons and other items for which the commercial power supplies are prone to leakage. (2) Workers should always use earth bands. Use of antistatic clothing, electric conductive shoes, and other safety equipment while at work is highly recommended. (3) Use conductive materials for this product's container, etc. (4) It is recommended that grounding mats be placed on the surfaces of assembly line workbench and the surrounding floor in work area, etc. (5) When mounting this product in parts or materials which can be electrically charged (printed wiring boards, plastic products, etc.), pay close attention to the static electricity in those parts. ESD may damage the product. (6) Humidity in working environment should be controlled to be 40 percent RH or higher. These countermeasures are most general, and there is a need to carefully confirm the line before starting mass production using this product (in the trial production, etc.). It is extremely important to prevent surge, eliminate it rapidly, and prevent it from spreading.
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein without notice. No liability is assumed as a result of their use or application. MITSUBISHI CONFIDENTIAL

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